Features of assembly of printed circuit boards.
Abstract
The article investigated a high-speed printed circuit board (printed circuit board), implemented using multilayer viscoelastic acrylic tapes, in order to increase the durability of the soldered joints of electronic packages by reducing vibration in an environment of random vibrations. It has been determined that the main disadvantage of this concept is its inability to mount electronic parts on the PCB surface area occupied by interlayers. For efficient spatial placement of electronics, this work proposes a new version of a high-end printed circuit board with multilayer viscoelastic tapes interlayered on a thin metal stiffener remote from the printed circuit board. This concept makes efficient use of the PCB area for mounting electronic parts, and also the ability to reduce vibration.
References
Raviteja, T.,Vedaraj I. An introduction of autonomous vehicles and a brief survey. J. Crit. Rev. –2020. – №7 – P. 196–202.
Boubeta-Puig J.,Moguel E., Sánchez-Figueroa F., Hernández J., Preciado J.C. An autonomous UAV architecture for remotesensing and intelligent decision-making. IEEE Internet Comput.–2018. –№22. – Р. 6–15.
Curzi G.,Modenini D., Tortora P. Large constellations of small satellites: A survey of near future challenges and missions.Aerospace. –2020. –№7. 133р.
Yoon S.W., Petrov B., Liu K. Advanced wafer level technology: Enabling innovations in mobile, IoT and wearable electronics. InProceedings of the 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Singapore, 2–4 December. – 2015. –Р. 1–5.
Fenske M.T. The development of lightweight electronics enclosures for space applications. SAMPE J. –1999. –Р. 25–34.
García-Pérez A.,Ravanbakhsh A.,Sorribes-Palmer F., Alonso G. Structural shock verification by numerical analysis of the EPD payload units on board Solar Orbiter spacecraft. Acta Astronaut. –2020. –Р. 282–292.
Xie D., Wu Z., Hai J., Economou M. Reliability enhancement of automotive electronic modules using various glues. InProceedings of the IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 29 May–1 June. –2018. –Р. 1–7.
Suhir E.,Ghaffarian R. Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) underfills for application in aerospaceelectronics—Brief review. Aerospace. –2018. –Р. 74.
Grieu M.,Massiot G., Maire O.,Chaillot A., Munier C., Bienvenu Y., Renard J. Durability modelling of a BGA componentunder random vibration. In Proceedings of the 9th International Conference on Thermal, Mechanical and Multiphysics Simulationand Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Freiburg im Breisgau, Germany, 20–23 April. – 2008. –Р. 1–8.
Lall P.,Pandurangan A.,Dornala K.,Suhling J., Deep J. Effect of shock angle on solder-joint reliability of potted assemblies under high-G shock. In Proceedings of the 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, 21–23 July. – 2020. –Р. 1–12.
Xiao W., Yu S., Liu L., Zhang F. Vibration reduction design of extension housing for printed circuit board based on particledamping materials. Appl. Acoust. –2020. –Р. 1–16.
Yeo H.C., Guo N., Du H., Chen M. Active vibration control of the print circuit boards using piezoelectric bimorphs.Key Eng. Mater. –2007. –Р. 1081–1084.
Veeramuthuvel P., Shankar K.,Sairajan K.K. Application of particle damper on electronic packages for spacecraft. Acta Astronaut. –2016.Р. 260–270.
Vibration Attenuation PID Damper Part Numbers. Режим доступу: https://topline.tv/Vibration_Damping.html (дата звернення: 18.10.2021).
Zhou X.D.,Xiong C.W. Study on vibration and damping of printed circuit boards treated with partial constrained dampinglayer. Adv. Mater. Res. –2014. –Р. 590–594.
Fang Z., Zheng L. Topology optimization for minimizing the resonant response of plates with constrained layer dampingtreatment. Shock. Vib. –2015. –Р.376-385.
Park T.Y., Shin S.J., Park S.W., Kang S.J., Oh H.U. High-damping PCB implemented by multi-layered viscoelastic acrylic tapes for use of wedge lock applications. Eng. Fract. Mech. –2021.–241р.
Steinberg, D.S. Vibration Analysis for Electronic Equipment, 3rd ed.; John Wiley & Sons Inc.: New York, NY, USA, 2000.
IPC-9701A. Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments; Association ConnectingElectronics Industries (IPC): Bannockburn, IL, USA. – 2006.
ECSS-E-HB-32-21A. Space Engineering: Adhesive Bonding Handbook; European Cooperation for Space Standardization (ECSS):Noordwijk, The Netherlands. – 2011.
Abstract views: 135 PDF Downloads: 125